In the assembly and testing process factory of a global semiconductor manufacturer, numerous wire bonding machines, numbering more than 100, are in operation. Despite the fact that the factory is a Class 1,000 cleanroom, foreign matter defects in the wire bonding process have been a problem.
Therefore, TRINC’s PHASED ARRAY IONIZERs (TAS-821 SFS) were installed in the equipment, and a countermeasure against
foreign matter was adopted using the dust prevention effect of space ionizing. As a result of the evaluation, the system succeeded in achieving an astonishing 77% reduction in foreign matter adhesion, and is being successively introduced to wire bonding equipment in the plant.