Clearing up the fundamentals of static electricity, these readings give an account of the semiconductor's breakdown caused by static, the problem caused by dust and foreign particles, and their countermeasures. They point out controversial points in the current methods, adduce new ideas and process, and introduce their application examples.
※These are to be issued in series.
TRINC LIBRARY > Static electricity readings (No.1: Static and dust fundamentals - 1)
  • <No.37> Static and dust fundamentals -37

Serialization No.37

Static and Dust Fundamentals - 37
(Table of contents)


Until the last number, we had covered 2 Problems caused by the static, 3 Fundamentals of the static, 4 Fundamentals of dust, 5 Fundamentals of antistatic and anti-dust measures, and 6 Antistatic and anti-dust measures of new age. In this number we discuss a sequel to 7 Anti-static/dust measures with full of errors.

7.Antistatic and anti-dust measures with full of errors

 7-10 Antistatic and anti-dust measures on the screen printers

  7-10-1 Screen printer’s standpoint
  7-10-2 Attention attracted in printed electronics
  7-10-3 High precision screen printing
  7-10-4 Static is built up because it is scraped with a squeegee
  7-10-5 Problematic air-assisted ionizing
  7-10-6 Air-free ionizing is a must.
   [1] BAR TRINC
   [2] TAPE TRINC
   [3] SMART TRINC
  7-10-7 Space ionizing is important.
  7-10-8 The air draft inside the factory scatters dust
  7-10-9 Air purifier is problematic.
  7-10-10 Subsidiary process
   (1) Ion air blow using Gun TRINC
   (2) Vacuuming dust by brushing and ionizing with Vacuum Cleaner TRINC
   (3) Chipping off dust while ionizing with Adhesive TRINC








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